DocumentCode
267751
Title
Microfabricated implantable wireless microsystems: Permanent and biodegradable implementations
Author
Allen, Mark G.
Author_Institution
Dept. of Electr. & Syst. Eng., Univ. of Pennsylvania, Philadelphia, PA, USA
fYear
2014
fDate
26-30 Jan. 2014
Firstpage
1
Lastpage
4
Abstract
The tremendous technological convergence of microfabrication technology, wireless communication technology, and low-power circuitry has opened the possibility of widespread use of microfabricated implantable wireless microsystems. A typical operational mode for these microsystems is to transduce a physiological parameter relevant to a disease state of interest, and wirelessly communicate this parameter external to the body to guide therapy. For chronic disease states, long-term, permanent sensors are of interest; while for acute disease states, biodegradable wireless microsystems may be of interest. Two microsystem examples, permanent pressure sensors for chronic monitoring of patients with congestive heart failure, and biodegradable pressure sensors for acute monitoring of patients with transient conditions, are given.
Keywords
biodegradable materials; biomedical electronics; biomedical telemetry; cardiology; diseases; low-power electronics; microfabrication; microsensors; patient monitoring; pressure sensors; prosthetics; wireless sensor networks; biodegradable implementations; biodegradable pressure sensors; chronic disease states; chronic patient monitoring; congestive heart failure; disease state-of-interest; long-term permanent sensors; low-power circuitry; microfabricated implantable wireless microsystems; microfabrication technology; operational mode; permanent implementations; permanent pressure sensors; physiological parameter; technological convergence; therapy; wireless communication technology; Biosensors; Heart; Magnetic sensors; Resonant frequency; Wireless communication; Wireless sensor networks;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location
San Francisco, CA
Type
conf
DOI
10.1109/MEMSYS.2014.6765558
Filename
6765558
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