• DocumentCode
    267767
  • Title

    Fabrication of a monolithic microdischarge-based pressure sensor for harsh environments

  • Author

    Xin Luo ; Eun, Christine Kay ; Gianchandani, Yogesh B.

  • Author_Institution
    Center for Wireless Integrated MicroSensing & Syst. (WIMS), Univ. of Michigan, Ann Arbor, MI, USA
  • fYear
    2014
  • fDate
    26-30 Jan. 2014
  • Firstpage
    64
  • Lastpage
    67
  • Abstract
    This paper presents a 6-mask monolithic fabrication process for a pressure sensor that uses a differential microdischarge signal to sense diaphragm deflection. Microdischarge-based transduction is potentially advantageous for device miniaturization and harsh environments because of inherently large signals and immunity to temperature. This work reports a monolithic fabrication process that successfully addresses a number of challenges for microdischarge-based pressure sensors, such as three-dimensional (3D) electrical connection by electroplating laser-drilled through-glass vias (TGVs), and backside terminals for appropriate packages. The device has an exterior volume of 585×540×200 μm3 (0.05 mm3). Preliminary results show an estimated average sensitivity equivalent to 9,800 ppm/MPa over 0-40 MPa pressure range.
  • Keywords
    electric connectors; electroplating; masks; microfabrication; pressure sensors; three-dimensional integrated circuits; electroplating laser; harsh environments; mask; microdischarge transduction; monolithic fabrication process; monolithic microdischarge; pressure 0 MPa to 40 MPa; pressure sensor; sense diaphragm deflection; three-dimensional electrical connection; through glass vias; Bonding; Cathodes; Contacts; Glass; Silicon; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2014.6765574
  • Filename
    6765574