DocumentCode :
267767
Title :
Fabrication of a monolithic microdischarge-based pressure sensor for harsh environments
Author :
Xin Luo ; Eun, Christine Kay ; Gianchandani, Yogesh B.
Author_Institution :
Center for Wireless Integrated MicroSensing & Syst. (WIMS), Univ. of Michigan, Ann Arbor, MI, USA
fYear :
2014
fDate :
26-30 Jan. 2014
Firstpage :
64
Lastpage :
67
Abstract :
This paper presents a 6-mask monolithic fabrication process for a pressure sensor that uses a differential microdischarge signal to sense diaphragm deflection. Microdischarge-based transduction is potentially advantageous for device miniaturization and harsh environments because of inherently large signals and immunity to temperature. This work reports a monolithic fabrication process that successfully addresses a number of challenges for microdischarge-based pressure sensors, such as three-dimensional (3D) electrical connection by electroplating laser-drilled through-glass vias (TGVs), and backside terminals for appropriate packages. The device has an exterior volume of 585×540×200 μm3 (0.05 mm3). Preliminary results show an estimated average sensitivity equivalent to 9,800 ppm/MPa over 0-40 MPa pressure range.
Keywords :
electric connectors; electroplating; masks; microfabrication; pressure sensors; three-dimensional integrated circuits; electroplating laser; harsh environments; mask; microdischarge transduction; monolithic fabrication process; monolithic microdischarge; pressure 0 MPa to 40 MPa; pressure sensor; sense diaphragm deflection; three-dimensional electrical connection; through glass vias; Bonding; Cathodes; Contacts; Glass; Silicon; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location :
San Francisco, CA
Type :
conf
DOI :
10.1109/MEMSYS.2014.6765574
Filename :
6765574
Link To Document :
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