• DocumentCode
    267796
  • Title

    Single-cell 3D Bio-MEMS environment with engineered geometry and physiologically relevant stiffnesses

  • Author

    Marelli, Marco ; Gadhari, Neha ; Boero, Giovanni ; Chiquet, Matthias ; Brugger, Juergen

  • Author_Institution
    Ecole Polytech. Fed. de Lausanne (EPFL), Lausanne, Switzerland
  • fYear
    2014
  • fDate
    26-30 Jan. 2014
  • Firstpage
    177
  • Lastpage
    180
  • Abstract
    We present a three dimensional (3D) microenvironment for on-chip cell culture, with engineered geometrical and mechanical properties. The device, named μ-flower, is based on micorfabricated cantilever beams bent out of plane by the intrinsic stresses of a bilayer structure. The use of Ti-SiO2 bilayers with various thicknesses allows spanning a large range of rigidities while keeping the size nearly constant. The geometrical and mechanical properties of the devices are thus decoupled, and the degrees of stiffness of several physiological tissues are matched. These characteristics make μ-flowers a microfabricated cell-culture substrate designed to mimic essential physical properties of the in vivo environment (dimensionality, shape and rigidity) in a precisely controlled way, at the single-cell scale, and with a high degree of parallelization.
  • Keywords
    beams (structures); bioMEMS; biological tissues; biomechanics; cantilevers; cellular biophysics; elastic constants; internal stresses; lab-on-a-chip; microfabrication; shear modulus; silicon compounds; tissue engineering; titanium; μ-flower; Ti-SiO2; Ti-SiO2 bilayers; bilayer structure; engineered geometrical properties; intrinsic stresses; mechanical properties; micorfabricated cantilever beams; microfabricated cell-culture substrate; on-chip cell culture; physiological tissues; physiologically relevant stiffnesses; rigidities; single-cell 3D biomems environment; single-cell scale; spanning; Gold; Physiology; Springs; Stress; Substrates; Three-dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2014.6765603
  • Filename
    6765603