DocumentCode :
267839
Title :
3D solid-state supercapacitors obtained by ALD coating of high-density carbon nanotubes bundles
Author :
Fiorentino, G. ; Vollebregt, Sten ; Tichelaar, F.D. ; Ishihara, Ryoichi ; Sarro, P.M.
Author_Institution :
ECTM-DIMES, Delft Univ. of Technol., Delft, Netherlands
fYear :
2014
fDate :
26-30 Jan. 2014
Firstpage :
342
Lastpage :
345
Abstract :
A three-dimensional solid-state miniaturized supercapacitor based on double conformal coating of Multiwalled Carbon Nanotubes (MWCNTs) bundles is presented. Atomic Layer Deposition (ALD) is used to deposit Al2O3 as dielectric layer and TiN as high aspect-ratio conformal counter-electrode on 2μm long MWCNTs bundles. The devices are realized using an IC wafer-scale manufacturing process and show a remarkable volumetric capacitance density value of 12mF/cm3 with high reproducibility (≤0.3E-12F deviation). The small footprint (100μm2 to 625μm2), a thickness of only 2μm, the extremely high capacitance density and the novel and easy-to-integrate fabrication process make it possible to realize high performance energy storage micro-devices.
Keywords :
atomic layer deposition; carbon nanotubes; supercapacitors; 3D solid-state supercapacitors; ALD coating; IC wafer-scale manufacturing process; MWCNT bundles; atomic layer deposition; dielectric layer; double-conformal coating; easy-to-integrate fabrication process; high-aspect ratio conformal counter-electrode; high-density carbon nanotube bundles; high-performance energy storage microdevices; multiwalled carbon nanotube bundles; size 2 mum; three-dimensional solid-state miniaturized supercapacitor; volumetric capacitance density value; Aluminum oxide; Capacitance; Coatings; Electrodes; Supercapacitors; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location :
San Francisco, CA
Type :
conf
DOI :
10.1109/MEMSYS.2014.6765646
Filename :
6765646
Link To Document :
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