DocumentCode
2678445
Title
Stress-driven MEMS assembly + electrostatic forces = 1mm diameter robot
Author
Karagozler, Mustafa Emre ; Goldstein, Seth Copen ; Reid, J. Robert
Author_Institution
Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
fYear
2009
fDate
10-15 Oct. 2009
Firstpage
2763
Lastpage
2769
Abstract
As the size of the modules in a self-reconfiguring modular robotic system shrinks and the number of modules increases, the flexibility of the system as a whole increases. In this paper, we describe the manufacturing methods and mechanisms for a 1 millimeter diameter module which can be manufactured en masse. The module is the first step towards realizing the basic unit of claytronics, a modular robotic system designed to scale to millions of units.
Keywords
electrostatics; micromechanical devices; robotic assembly; claytronics; electrostatic force; self-reconfiguring modular robotic system; size 1 mm; stress-driven MEMS assembly; Circuits; Electrostatics; Energy exchange; Intelligent robots; Lithography; Micromechanical devices; Pulp manufacturing; Robotic assembly; Shape; USA Councils;
fLanguage
English
Publisher
ieee
Conference_Titel
Intelligent Robots and Systems, 2009. IROS 2009. IEEE/RSJ International Conference on
Conference_Location
St. Louis, MO
Print_ISBN
978-1-4244-3803-7
Electronic_ISBN
978-1-4244-3804-4
Type
conf
DOI
10.1109/IROS.2009.5354049
Filename
5354049
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