• DocumentCode
    2678445
  • Title

    Stress-driven MEMS assembly + electrostatic forces = 1mm diameter robot

  • Author

    Karagozler, Mustafa Emre ; Goldstein, Seth Copen ; Reid, J. Robert

  • Author_Institution
    Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
  • fYear
    2009
  • fDate
    10-15 Oct. 2009
  • Firstpage
    2763
  • Lastpage
    2769
  • Abstract
    As the size of the modules in a self-reconfiguring modular robotic system shrinks and the number of modules increases, the flexibility of the system as a whole increases. In this paper, we describe the manufacturing methods and mechanisms for a 1 millimeter diameter module which can be manufactured en masse. The module is the first step towards realizing the basic unit of claytronics, a modular robotic system designed to scale to millions of units.
  • Keywords
    electrostatics; micromechanical devices; robotic assembly; claytronics; electrostatic force; self-reconfiguring modular robotic system; size 1 mm; stress-driven MEMS assembly; Circuits; Electrostatics; Energy exchange; Intelligent robots; Lithography; Micromechanical devices; Pulp manufacturing; Robotic assembly; Shape; USA Councils;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent Robots and Systems, 2009. IROS 2009. IEEE/RSJ International Conference on
  • Conference_Location
    St. Louis, MO
  • Print_ISBN
    978-1-4244-3803-7
  • Electronic_ISBN
    978-1-4244-3804-4
  • Type

    conf

  • DOI
    10.1109/IROS.2009.5354049
  • Filename
    5354049