Title :
A study of high density multilayer LSI
Author :
Matsunami, Mitsuo ; Koba, Masayoshi ; Miyake, Ryuichiro
Author_Institution :
Sharp Corp., Nara, Japan
Abstract :
Describes a new type of high density multilayer LSI chip which is made up of several piled chips. Prescribed interconnections on the conventional wafer, are fabricated first. Thin chips with through-holes (about the size of pad) are fixed to the available parts of the under-layer chip. Each chip is interconnected through the holes. As a result, the chips will be equivalent to a hybrid IC which has several chips. This model is equal to the large scale high density LSI, the multichip substrate system, and hybrid WSI (Wafer Scale Integration)
Keywords :
VLSI; hybrid integrated circuits; integrated circuit technology; 3D integrated circuits; Wafer Scale Integration; chips with through-holes; high density multilayer LSI; hybrid IC; hybrid WSI; large scale high density LSI; multichip substrate system; several piled chips; thin chips; vertical integration; via hole interconnection; Fabrication; Hybrid integrated circuits; Instruments; Integrated circuit interconnections; Integrated circuit modeling; Laboratories; Large scale integration; Nonhomogeneous media; Semiconductor device modeling; Substrates;
Conference_Titel :
Wafer Scale Integration, 1990. Proceedings., [2nd] International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-8186-9013-5
DOI :
10.1109/ICWSI.1990.63916
