A study of high density multilayer LSI

Author

Matsunami, Mitsuo ; Koba, Masayoshi ; Miyake, Ryuichiro

Author_Institution

Sharp Corp., Nara, Japan

fYear

1990

fDate

23-25 Jan 1990

Firstpage

322

Lastpage

328

Abstract

Describes a new type of high density multilayer LSI chip which is made up of several piled chips. Prescribed interconnections on the conventional wafer, are fabricated first. Thin chips with through-holes (about the size of pad) are fixed to the available parts of the under-layer chip. Each chip is interconnected through the holes. As a result, the chips will be equivalent to a hybrid IC which has several chips. This model is equal to the large scale high density LSI, the multichip substrate system, and hybrid WSI (Wafer Scale Integration)

Keywords

VLSI; hybrid integrated circuits; integrated circuit technology; 3D integrated circuits; Wafer Scale Integration; chips with through-holes; high density multilayer LSI; hybrid IC; hybrid WSI; large scale high density LSI; multichip substrate system; several piled chips; thin chips; vertical integration; via hole interconnection; Fabrication; Hybrid integrated circuits; Instruments; Integrated circuit interconnections; Integrated circuit modeling; Laboratories; Large scale integration; Nonhomogeneous media; Semiconductor device modeling; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Wafer Scale Integration, 1990. Proceedings., [2nd] International Conference on

Conference_Location

San Francisco, CA

Print_ISBN

0-8186-9013-5

Type

conf

DOI

10.1109/ICWSI.1990.63916

Filename

63916