DocumentCode :
267873
Title :
Fabrication of anisotropic and hierarchical undulations by benchtop surface wrinkling
Author :
Kang Wei ; Yi Zhao
Author_Institution :
Dept. of Biomed. Eng., Ohio State Univ., Columbus, OH, USA
fYear :
2014
fDate :
26-30 Jan. 2014
Firstpage :
474
Lastpage :
477
Abstract :
This paper reports an electrical discharge assisted surface wrinkling process to produce hierarchical and anisotropic surface patterns on polymethylsiloxane (PDMS). Highly ordered sinusoidal wrinkles with tailored height (h) and wavelength (λ) are fabricated by surface modification of a uniaxially pre-strained PDMS using a hand-held corona discharger followed by strain relaxation. The resulting nanoscale wrinkles overlay on 1) microwrinkled substrate and 2) reflowed microstructures to create anisotropic and hierarchical surface topographies. This electrical discharge assisted wrinkling process for creating multi-scale roughness is accessible in general wet lab environments. Such structures have broad applications in optical gratings, cell mechanics studies, and micro/nanofluidics.
Keywords :
corona; crystal microstructure; diffraction gratings; discharges (electric); microfluidics; polymers; surface topography; PDMS; anisotropic surface patterns; anisotropic undulations; cell mechanics; electrical discharge; hand-held corona discharger; hierarchical surface patterns; hierarchical undulations; microfluidics; microstructures; microwrinkled substrate; multiscale roughness; nanofluidics; optical gratings; polymethylsiloxane; sinusoidal wrinkles; strain relaxation; surface modification; surface topography; surface wrinkling; wet lab environments; Discharges (electric); Microstructure; Partial discharges; Substrates; Surface discharges; Surface topography; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location :
San Francisco, CA
Type :
conf
DOI :
10.1109/MEMSYS.2014.6765680
Filename :
6765680
Link To Document :
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