• DocumentCode
    2679055
  • Title

    A framework for double patterning-enabled design

  • Author

    Ghaida, Rani S. ; Agarwal, Kanak B. ; Nassif, Sani R. ; Yuan, Xin ; Liebmann, Lars W. ; Gupta, Puneet

  • fYear
    2011
  • fDate
    7-10 Nov. 2011
  • Firstpage
    14
  • Lastpage
    20
  • Abstract
    While the next generation of lithography systems is still under development, extending optical lithography using double patterning (DP) is the only solution to continue technology scaling. The biggest technical challenge of DP is the presence of mask-assignment conflicts in dense layers. In this paper, we propose a framework for DP conflict removal for standard cells. First, we offer an O(n) algorithm for mask assignment (up to 200× faster than the ILP-based approach) that guarantees a conflict-free solution if one exists. We then formulate the problem of conflict removal as a linear program (LP), which permits an extremely fast run-time (less than 10 seconds in real time for typical cells). The framework removes DP conflicts and legalizes the layout across all layers simultaneously while minimizing layout perturbation. For cells from a commercial 22nm library designed without any DP awareness, our method usually removes all DP conflicts without any area increase; for some complex cells, the method still removes all conflicts with a modest 6.7% average increase in area. The method is more general, however, and can also be applied for macro layouts and the interconnect layers in complete designs as we demonstrate in the paper.
  • Keywords
    integer programming; linear programming; photolithography; ILP; double patterning optical lithography; integer linear programming; layout perturbation minimization; mask-assignment conflict; next generation of lithography system; size 22 nm; Art; Compaction; Labeling; Layout; Lithography; Shape; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design (ICCAD), 2011 IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    978-1-4577-1399-6
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2011.6105299
  • Filename
    6105299