DocumentCode
2679245
Title
An interconnection network for a novel reconfigurable circuit board
Author
Norman, Richard ; Lepercq, Etienne ; Blaquière, Yves ; Valorge, Olivier ; Basile-Bellavance, Yan ; Prytula, Richard ; Savaria, Yvon
Author_Institution
GR2M, Ecole Polytech. de Montreal, Montreal, QC
fYear
2008
fDate
22-25 June 2008
Firstpage
129
Lastpage
132
Abstract
This paper presents a programmable interconnection network for a novel multi-reticle integrated circuit providing a reconfigurable circuit board for rapid system prototyping. This multi-dimensional mesh grid network, called WaferNettrade, can actively interconnect any pair of pins of integrated circuits deposited on the configurable system board. Two crossbar architectures are implemented and compared, one based on crosspoints and one based on standard cell multiplexers. Implementation results show the feasibility of this proposed cell-based array network that could interconnect a very large number of nodes, spread over an area that could fill a whole wafer, using a typical 6-metal 0.18 mum CMOS technology.
Keywords
CMOS integrated circuits; integrated circuit interconnections; printed circuits; prototypes; CMOS technology; WaferNet; cell-based array network; multidimensional mesh grid network; multireticle integrated circuit; programmable interconnection network; rapid system prototyping; reconfigurable circuit board; size 0.18 mum; CMOS technology; Contacts; Costs; Integrated circuit interconnections; Integrated circuit technology; Multiprocessor interconnection networks; Pins; Printed circuits; Prototypes; Sea surface;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems and TAISA Conference, 2008. NEWCAS-TAISA 2008. 2008 Joint 6th International IEEE Northeast Workshop on
Conference_Location
Montreal, QC
Print_ISBN
978-1-4244-2331-6
Electronic_ISBN
978-1-4244-2332-3
Type
conf
DOI
10.1109/NEWCAS.2008.4606338
Filename
4606338
Link To Document