Title : 
Fabrication and characterization of all hydrogel cantilevers for atomic force microscopy applications
         
        
            Author : 
Il Lee ; Jungchul Lee
         
        
            Author_Institution : 
Dept. of Mech. Eng., Sogang Univ., Seoul, South Korea
         
        
        
        
        
        
            Abstract : 
This paper reports a novel method for fabricating hydrogel based microcantilevers by using dynamic mask lithography. A hydrogel, polyethyleneglycol diacrylate (PEGDA), was introduced between two parallel polydimethylsiloxane (PDMS) guides then cured with ultra-violet (UV) exposure to intended shape and size defined by the dynamic mask; an image sent from a PC to a liquid crystal display projector. One PDMS guide has an embedded glass piece which serves as a handle for the microcantilever and the other guide is with or without an inverted pyramid tip mold to fabricate tip-integrated or tipless microcantilevers, respectively. After fabricated hydrogel microcantilevers were thoroughly characterized by using a stylus profilometer and an atomic force microscope (AFM), they were employed for both contact and non-contact mode AFM imaging. In case of non-contact mode, the imaging performance of hydrogel AFM cantilevers was comparable to that of commercial silicon AFM cantilevers.
         
        
            Keywords : 
atomic force microscopy; cantilevers; hydrogels; lithography; microfabrication; micromechanical devices; PDMS; PEGDA; atomic force microscopy application; commercial silicon AFM cantilevers; contact-noncontact mode AFM imaging; dynamic mask lithography; hydrogel-based microcantilever fabrication; liquid crystal display projector; parallel polydimethylsiloxane; polyethyleneglycol diacrylate; stylus profilometer; tip-integrated microcantilevers; tipless microcantilevers; ultraviolet exposure; Fabrication; Force; Glass; Imaging; Lithography; Silicon;
         
        
        
        
            Conference_Titel : 
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
         
        
            Conference_Location : 
San Francisco, CA
         
        
        
            DOI : 
10.1109/MEMSYS.2014.6765745