Printed circuit board material and design considerations for wireless applications

Author

Daigle, Bob

Author_Institution

Lurie R&D Centre, Rogers Corp., Rogers, CT, USA

fYear

1996

fDate

28-31 May 1996

Firstpage

354

Lastpage

357

Abstract

Designers are moving towards material systems which can be fabricated using conventional epoxy/glass printed circuit board (PCB) processes. This allows microwave circuits to be built using the vast fabrication infrastructure available for digital circuits. This paper provides basic background information about substrate material characteristics and design considerations, which are critical for wireless applications. Material characteristics discussed include dissipation factor, dielectric constant tolerances and stability. Design and material options which allow microwave circuits to be manufactured by conventional FR4 fabricators are emphasized

Keywords

circuit stability; design for manufacture; microwave circuits; permittivity; printed circuit design; printed circuit manufacture; FR4 fabricators; dielectric constant tolerances; dissipation factor; epoxy/glass printed circuit board; microwave circuits; printed circuit board design; printed circuit board materials; stability; substrate material characteristics; wireless applications; Circuit stability; Dielectric constant; Dielectric materials; Dielectric substrates; Digital circuits; Fabrication; Glass; Manufacturing; Microwave circuits; Printed circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 1996. Proceedings., 46th

Conference_Location

Orlando, FL

ISSN

0569-5503

Print_ISBN

0-7803-3286-5

Type

conf

DOI

10.1109/ECTC.1996.517413

Filename

517413