• DocumentCode
    2679403
  • Title

    Reliability and characterization of MLC decoupling capacitors with C4 interconnections

  • Author

    Scheider, Donald ; Hopkins, Donald ; Zucco, Paul ; Moszczynski, Edward ; Griffin, Michael ; Takacs, Mark ; Galvagni, John

  • Author_Institution
    Microelectron. Div., IBM Corp., Hopewell Junction, NY, USA
  • fYear
    1996
  • fDate
    28-31 May 1996
  • Firstpage
    365
  • Lastpage
    374
  • Abstract
    Multilayer ceramic (MLC) capacitors are composite structures made of alternating layers of ceramic (dielectric material) and metal (electrodes). The dielectric material is barium titanate-based ceramic and the electrodes are made of platinum. C4 (controlled collapse chip connections) technology is used to provide multiple attachment points to substrates. A high dielectric constant of barium titanate-based ceramic helps to achieve a large capacitance/size ratio. The capacitance ranges from 32 nF to 100 nF in body sizes up to 1.85×1.6×0.85 mm. In this paper, we cover design, reliability and electrical characterization of capacitors with C4 interconnections. Reliability stress tests performed during qualification were designed to cover a wide range of field applications and included stress tests such as liquid to liquid thermal shock, moisture resistance and thermal cycles per Mil.Std., high temperature bias, temperature humidity bias and tensile pull. A visual inspection of parts post stress and physical analysis of unstressed parts were also performed. The parameters monitored during stress testing were: capacitance, leakage current and plate resistance. The electrical characterization measurements included effects of frequency, temperature and voltage. Inductance measurements were included based on a self-resonance technique
  • Keywords
    ceramic capacitors; integrated circuit interconnections; reliability; 32 to 100 nF; BaTiO3-Pt; C4 interconnections; MLC decoupling capacitor; barium titanate; capacitance; composite structure; controlled collapse chip connections; design; dielectric constant; dielectric material; electrical characteristics; high temperature bias; leakage current; liquid to liquid thermal shock; moisture resistance; multilayer ceramic capacitor; plate resistance; platinum electrode; reliability; stress testing; temperature humidity bias; tensile pull; thermal cycling; Barium; Capacitance; Capacitors; Ceramics; Dielectric materials; Electrodes; Tensile stress; Testing; Thermal resistance; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 1996. Proceedings., 46th
  • Conference_Location
    Orlando, FL
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-3286-5
  • Type

    conf

  • DOI
    10.1109/ECTC.1996.517415
  • Filename
    517415