• DocumentCode
    2679679
  • Title

    Universal statistical cure for predicting memory loss

  • Author

    Joshi, R. ; Kanj, R. ; Peiyuan Wang ; Hai Li

  • Author_Institution
    IBM T.J. Watson Lab., Yorktown Heights, NY, USA
  • fYear
    2011
  • fDate
    7-10 Nov. 2011
  • Firstpage
    236
  • Lastpage
    239
  • Abstract
    Novel nonvolatile memory (NVM) technologies are gaining significant attention from semiconductor industry in the competition of universal memory development. However, as nanoscale devices, these emerging NVMs suffer from the intrinsic technology challenges such as large process variations. The importance of effective statistical approaches for yield estimation and robust design arises in the commercialization of the emerging nonvolatile memory technologies. In this paper, we used Spin-Transfer Torque Random Access Memory (STT-RAM) as an example to explain some new memory failures mechanisms we have to face in the emerging memory technologies. Then, we applied a mixture importance sampling methodology to enable yield-driven design and extended its application beyond memories to peripheral circuits and logic blocks. The goal of these discussions is to propose a universal statistical methodology to predict memory loss and enable robust design practices.
  • Keywords
    random-access storage; statistical analysis; logic blocks; memory failure; memory loss; nonvolatile memory; peripheral circuits; robust design; semiconductor industry; spin-transfer torque random access memory; statistical approach; universal memory development; universal statistical cure; universal statistical methodology; yield estimation; Magnetic tunneling; Monte Carlo methods; Phase change random access memory; Resistance; Resistors; Saturation magnetization; MTJ; STT-RAM; Universal memory; memory yield improvement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design (ICCAD), 2011 IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    978-1-4577-1399-6
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2011.6105333
  • Filename
    6105333