DocumentCode :
2679826
Title :
Wafer scale integration (WSI) of programmable gate arrays (PGA´s)
Author :
McDonald, J.F. ; Dabral, S. ; Philhower, R. ; Russinovich, M.E.
Author_Institution :
Center for Integrated Electron., Rensselaer Polytech. Inst., Troy, NY, USA
fYear :
1990
fDate :
23-25 Jan 1990
Firstpage :
329
Lastpage :
338
Abstract :
Wafer scale integration of memories by row and column repair follows a well established path developed in industry for the repair of large DRAM´s. Rows and columns in these memories can be diagnosed and those found faulty can be replaced by spares. If the entire wafer of dies can be fully repaired then all the cells on the wafer may be interconnected using artwork for chip to chip wiring which is the same on all wafers. What one would like is a similar approach which could be applied to logic circuits. Traditionally, however, logic is viewed as being inherently less regular than memory. This paper addresses one approach to accomplishing WSI based on a highly regular, restructurable logic component known as Programmable Gate Array (PGA), which is also known as a Logic Component Array (LCA)
Keywords :
VLSI; integrated circuit technology; integrated logic circuits; logic arrays; redundancy; LCA; Logic Component Array; PGA; WSI; column repair; logic circuits; memories; programmable gate arrays; regularised logic; restructurable logic component; wafer scale integration; Circuit faults; Delay; Electronics packaging; Fabrication; Integrated circuit interconnections; Integrated circuit manufacture; Programmable logic arrays; Testing; Wafer scale integration; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wafer Scale Integration, 1990. Proceedings., [2nd] International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-8186-9013-5
Type :
conf
DOI :
10.1109/ICWSI.1990.63917
Filename :
63917
Link To Document :
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