DocumentCode :
2679863
Title :
High aspect ratio quarter-micron electroless copper integrated technology
Author :
Shacham-Diamand, Y. ; Lopatin, S.Y.
Author_Institution :
Cornell University
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
11
Lastpage :
14
Keywords :
Chemical technology; Chemical vapor deposition; Conductivity; Copper; Metallization; Protection; Temperature; Tin; Transistors; Ultra large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887494
Filename :
887494
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2679863
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