DocumentCode

2679876

Title

CVD process for copper interconnection

Author

Marcada, C. ; Richard, E. ; Torres, J. ; Palleau, J. ; Madar, R.

Author_Institution

France Telecom, CNET

fYear

1997

fDate

16-19 March 1997

Firstpage

15

Lastpage

17

Keywords

Adhesives; Chemical technology; Copper; Electric resistance; Frequency; Metallization; Morphology; Reproducibility of results; Telecommunications; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop

Conference_Location

Villard de Lans, France

ISSN

1266-0167

Type

conf

DOI

10.1109/MAM.1998.887495

Filename

887495