• DocumentCode
    2679893
  • Title

    Copper metallization for advanced ULSI devices using spray electroless plating technology

  • Author

    Nguyen, V.T.

  • Author_Institution
    FSI International
  • fYear
    1997
  • fDate
    16-19 March 1997
  • Firstpage
    18
  • Lastpage
    19
  • Keywords
    Chemical vapor deposition; Conductivity; Copper; Delay effects; Inorganic materials; Integrated circuit interconnections; Metallization; Semiconductor materials; Spraying; Ultra large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
  • Conference_Location
    Villard de Lans, France
  • ISSN
    1266-0167
  • Type

    conf

  • DOI
    10.1109/MAM.1998.887496
  • Filename
    887496
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2679893