• DocumentCode
    2679910
  • Title

    Conformal copper deposition in deep trenches

  • Author

    Bollmann, D. ; Merkel, R. ; Klumpp, A.

  • Author_Institution
    Institut fur Festkopertechnologie
  • fYear
    1997
  • fDate
    16-19 March 1997
  • Firstpage
    20
  • Lastpage
    22
  • Keywords
    Chemical vapor deposition; Conductivity; Copper; Filling; Integrated circuit interconnections; Integrated circuit technology; Metallization; Substrates; Temperature; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
  • Conference_Location
    Villard de Lans, France
  • ISSN
    1266-0167
  • Type

    conf

  • DOI
    10.1109/MAM.1998.887497
  • Filename
    887497
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2679910