Title :
Low temperature dry etching of copper using a new chemical approach
Author :
Kruck, Th. ; Schober, M.
Author_Institution :
University of Cologne, Institute of Inorganic Chemistry
Keywords :
Chemical vapor deposition; Copper; Dry etching; Inorganic chemicals; Inorganic materials; Metallization; Microelectronics; Semiconductor materials; Sputter etching; Temperature;
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
DOI :
10.1109/MAM.1998.887501
