DocumentCode

2679991

Title

Copper CMP evaluation: slurry chemical effect on planarization

Author

Romagna, F. ; Fayolle, M.

Author_Institution

GRESSI/CNET- France-Telecom

fYear

1997

fDate

16-19 March 1997

Firstpage

32

Lastpage

35

Keywords

Chemical industry; Circuits; Copper; Etching; Inorganic materials; Metallization; Metals industry; Planarization; Slurries; Topology;

fLanguage

English

Publisher

ieee

Conference_Titel

Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop

Conference_Location

Villard de Lans, France

ISSN

1266-0167

Type

conf

DOI

10.1109/MAM.1998.887502

Filename

887502