DocumentCode :
2679995
Title :
A polymeric micro actuator to be integrated into an organic material based lab on chip microsystem
Author :
Lefevre, F. ; Izquierdo, R. ; Schougaard, S.B.
Author_Institution :
Resmiq & Dept. of Comput. Sci., Univ. du Quebec a Montreal, Montreal, QC
fYear :
2008
fDate :
22-25 June 2008
Firstpage :
318
Lastpage :
322
Abstract :
The manufacturing of a microvalve actuated by the electroactive polymer polypyrrole has been investigated. The actuator uses the electrochemically induced out-of-plane strain of the polypyrrole/NaDBS (sodium dodecylbenzene sulfonate) system. The manufacturing process of the all polymer (microfluidic channels and actuator) device has been optimized. Deposition of PPY on gold electrodes was achieved even if there is no chemical link between gold and the polymer. Delamination at the gold/PPY interface was observed after the first cycle of actuation. The use of a different electrode material to enable a chemical link between the electrode and the polymer is proposed. This type of micro actuator can easily be integrated in an all organic microsystem. It can also be assembled in series to form an integrated micropump for a disposable device.
Keywords :
bioMEMS; biomedical electrodes; conducting polymers; delamination; lab-on-a-chip; manufacturing processes; microactuators; microchannel flow; microelectrodes; micropumps; microvalves; delamination; disposable device; electroactive polymer polypyrrole; electrochemically induced out-of-plane strain; electrode material; gold electrode; integrated micropump; lab-on-chip microsystem; manufacturing process; microfluidic channel; microvalve actuator; organic material; organic microsystem; polymeric microactuator; polypyrrole-NaDBS system; sodium dodecylbenzene sulfonate system; Actuators; Capacitive sensors; Chemicals; Electrodes; Gold; Manufacturing; Microactuators; Microvalves; Organic materials; Polymers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems and TAISA Conference, 2008. NEWCAS-TAISA 2008. 2008 Joint 6th International IEEE Northeast Workshop on
Conference_Location :
Montreal, QC
Print_ISBN :
978-1-4244-2331-6
Electronic_ISBN :
978-1-4244-2332-3
Type :
conf
DOI :
10.1109/NEWCAS.2008.4606385
Filename :
4606385
Link To Document :
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