DocumentCode :
2680006
Title :
Multilevel interconnection technologies and future requirements for logic applications
Author :
Brillouët, M.
Author_Institution :
France Telecom CNET
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
36
Lastpage :
39
Keywords :
Atherosclerosis; Dielectric constant; Dielectric materials; Logic; Materials reliability; Parasitic capacitance; Plugs; Power system interconnection; Telecommunications; Thermal stability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887503
Filename :
887503
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2680006
