Title :
Non-contact electrical test of the BGA substrate by electro-optic probing technique
Author :
Kuo, W.K. ; Tong, D.Z. ; Wu, C.J. ; Lai, Thomson
Author_Institution :
Dept. of Electro-Opt. Eng., Nat. Huwei Inst. of Technol., Yunlin, Taiwan
Abstract :
A new technique to test BGA substrate using the electro-optic probing technique is investigated. This technique can detect open circuits in the BGA substrate with high spatial resolution. Measurement results of a real BGA substrate are reported.
Keywords :
automatic optical inspection; ball grid arrays; circuit reliability; flip-chip devices; integrated circuit packaging; integrated circuit testing; substrates; BGA substrate; electro-optic probing; noncontact electrical test; open circuits; spatial resolution; Apertures; Bonding; Circuit testing; Electronics packaging; Performance evaluation; Probes; Rubber; Shape; Spatial resolution; System testing;
Conference_Titel :
Lasers and Electro-Optics, 2003. CLEO/Pacific Rim 2003. The 5th Pacific Rim Conference on
Print_ISBN :
0-7803-7766-4
DOI :
10.1109/CLEOPR.2003.1276953
