DocumentCode :
2680118
Title :
OMCVD TiN diffusion barrier for copper contact and via/interconnects structures
Author :
Marcadal, C. ; Richard, E. ; Torres, Juana ; Palleau, J. ; Ulmer, L. ; Perroud, L.
Author_Institution :
GRESSI CNET/FT
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
54
Lastpage :
55
Keywords :
Atherosclerosis; Conductivity; Copper; Metallization; Microstructure; Semiconductor materials; Silicon; Stability; Tin; Titanium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887511
Filename :
887511
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2680118
