DocumentCode :
2680264
Title :
W CMP process integration
Author :
Sicurani, E. ; Fayolle, M. ; Gobil, Y. ; Morand, Y.
Author_Institution :
SGS Thomson R&D division
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
86
Lastpage :
87
Keywords :
Etching; Geometry; Inorganic materials; Metallization; Plugs; Research and development; Semiconductor films; Slurries; Temperature; Tungsten;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887521
Filename :
887521
Link To Document :
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