Title :
W CMP process integration
Author :
Sicurani, E. ; Fayolle, M. ; Gobil, Y. ; Morand, Y.
Author_Institution :
SGS Thomson R&D division
Keywords :
Etching; Geometry; Inorganic materials; Metallization; Plugs; Research and development; Semiconductor films; Slurries; Temperature; Tungsten;
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
DOI :
10.1109/MAM.1998.887521
