DocumentCode
2680286
Title
Failure diagnosis of asymmetric aging under NBTI
Author
Velamala, Jyothi Bhaskarr ; Ravi, Venkatesa ; Cao, Yu
Author_Institution
Sch. of ECEE, Arizona State Univ., Tempe, AZ, USA
fYear
2011
fDate
7-10 Nov. 2011
Firstpage
428
Lastpage
433
Abstract
Design for reliability is becoming an important step in the design cycle with CMOS technology scaling, demanding need for efficient and accurate reliability simulation methods in the design stage. Traditional aging analysis does not differentiate NBTI induced delay shift in rising and falling edges, thereby assuming averaging effect due to recovery. It is essential to identify the critical operation conditions that are more susceptible to timing violations under aging. In this paper, by identifying the critical moments in circuit operation and considering the asymmetric aging effects, timing violations under NBTI effect are correctly predicted. The unique features of this work include: (1) delay modeling of a digital gate due to threshold voltage (Vth) shift using delay dependence on supply voltage from cell library; (2) asymmetric aging analysis is conducted by recognizing the critical points in circuit operation; and (3) setup and hold timing violations due to NBTI induced path delay shift in logic and clock buffer are investigated. This failure assessment method is further demonstrated in ISCAS89 benchmark circuits using 45nm Nangate standard cell library to extract aging information in critical paths. The proposed failure diagnosis enables resilient design techniques to mitigate circuit aging under NBTI.
Keywords
CMOS logic circuits; ageing; failure analysis; fault diagnosis; integrated circuit design; integrated circuit reliability; logic design; logic gates; CMOS technology; ISCAS89 benchmark circuits; NAND gate standard cell library; NBTI induced path delay shift; asymmetric aging effect analysis; circuit aging mitigation; clock buffer; delay dependence; delay modeling; digital gate; failure assessment method; failure diagnosis; negative bias temperature instability; reliability simulation methods; resilient design techniques; size 45 nm; threshold voltage; Aging; Clocks; Delay; Integrated circuit modeling; Logic gates; Stress; Asymmetric Aging; Design for Reliability; Negative Bias Temperature Instability; Static Timing Analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design (ICCAD), 2011 IEEE/ACM International Conference on
Conference_Location
San Jose, CA
ISSN
1092-3152
Print_ISBN
978-1-4577-1399-6
Electronic_ISBN
1092-3152
Type
conf
DOI
10.1109/ICCAD.2011.6105364
Filename
6105364
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