DocumentCode
268029
Title
Nanoelectromechanical tunneling switches based on self-assembled molecular layers
Author
Niroui, Farnaz ; Deotare, Parag B. ; Sletten, Ellen M. ; Wang, Annie I. ; Yablonovitch, Eli ; Swager, Timothy M. ; Lang, Jeffrey H. ; Bulovic, V.
Author_Institution
Massachusetts Inst. of Technol., Cambridge, MA, USA
fYear
2014
fDate
26-30 Jan. 2014
Firstpage
1103
Lastpage
1106
Abstract
We propose nanoelectromechanical (NEM) switches that operate via electromechanical modulation of tunneling current through several-nanometer-thick switching gaps. In such a device, direct contact between electrodes is avoided by utilizing self-assembled molecular layers to define the switching gap. Electrostatic compression of the molecular layer reduces the tunneling gap leading to an exponential increase in the tunneling current, turning on the switch. With removal of an applied voltage, the compressed layer provides the elastic restoring force necessary to overcome the surface adhesive forces, turning off the switch. Thus, the proposed tunneling NEM switch may enable low-voltage operation while simultaneously mitigating device failure due to stiction. This principle is experimentally investigated using a prototype two-terminal tunneling NEM switch with a switching gap formed by a fluorinated decanethiol layer. In this device, the presence of the molecular film promotes repeatable switching. A comparison of the switch operation with a theoretical model indicates electrostatic compression of the molecular switching gap.
Keywords
assembling; electrodes; nanoelectromechanical devices; switches; electrodes; electromechanical modulation; electrostatic compression; fluorinated decanethiol layer; molecular switching gap; nanoelectromechanical tunneling switches; self-assembled molecular layers; surface adhesive forces; tunneling current; Electrodes; Films; Force; Gold; Self-assembly; Switches; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location
San Francisco, CA
Type
conf
DOI
10.1109/MEMSYS.2014.6765838
Filename
6765838
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