Title :
Planar aluminiurn multilevel interconnection formed by electrochemical anodizing technique
Author :
Surganov, V. ; Mozalev, A.
Author_Institution :
University of Informatics and Radioelectronics
Keywords :
Aluminum; Conducting materials; Costs; Dielectric materials; Manufacturing processes; Metallization; Planarization; Plasma applications; Plasma chemistry; Plasma materials processing;
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
DOI :
10.1109/MAM.1998.887523