DocumentCode
2680297
Title
Planar aluminiurn multilevel interconnection formed by electrochemical anodizing technique
Author
Surganov, V. ; Mozalev, A.
Author_Institution
University of Informatics and Radioelectronics
fYear
1997
fDate
16-19 March 1997
Firstpage
91
Lastpage
92
Keywords
Aluminum; Conducting materials; Costs; Dielectric materials; Manufacturing processes; Metallization; Planarization; Plasma applications; Plasma chemistry; Plasma materials processing;
fLanguage
English
Publisher
ieee
Conference_Titel
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location
Villard de Lans, France
ISSN
1266-0167
Type
conf
DOI
10.1109/MAM.1998.887523
Filename
887523
Link To Document