DocumentCode :
2680299
Title :
Advanced materials for interconnections of the future - need and strategy
Author :
Murarka, S.P.
Author_Institution :
SRC Center for Advanced Interconnect Science and Technology
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
93
Lastpage :
93
Keywords :
Costs; Inorganic materials; Integrated circuit interconnections; Integrated circuit manufacture; Integrated circuit technology; Lead compounds; Materials science and technology; Metallization; Semiconductor device manufacture; Semiconductor materials;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887524
Filename :
887524
Link To Document :
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