DocumentCode :
2680468
Title :
Titanium monophosphide (TIP) layers as diffusion barriers
Author :
Leutenecker, R. ; Froschle, B. ; Ramm, P.
Author_Institution :
Fraunhofer-Institute for Solid State Technology
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
124
Lastpage :
124
Keywords :
Circuit testing; Coatings; Hydrogen; Rapid thermal annealing; Rapid thermal processing; Solid state circuits; Sputtering; Temperature; Tin; Titanium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887537
Filename :
887537
Link To Document :
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