DocumentCode
2680477
Title
Ultra trace analysis and electrical characterization of Cu diffusion through thin quasi-amorphous Ta-N-O barriers
Author
Stavrev, M. ; Fischer, D. ; Wenzel, C. ; Heiser, T.
Author_Institution
Dresden University of Technology
fYear
1997
fDate
16-19 March 1997
Firstpage
125
Lastpage
126
Keywords
Contacts; Electric resistance; Electromigration; Grain boundaries; Inorganic materials; Laboratories; Metallization; Optical films; Protection; X-ray scattering;
fLanguage
English
Publisher
ieee
Conference_Titel
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location
Villard de Lans, France
ISSN
1266-0167
Type
conf
DOI
10.1109/MAM.1998.887539
Filename
887539
Link To Document