مرکز منطقه ای اطلاع رساني علوم و فناوري - TiN diffusion barriers for copper metalization

DocumentCode :

2680497

Title :

TiN diffusion barriers for copper metalization

Author :

Baumann, J. ; Werner, T. ; Rennau, M. ; Kaufmann, Ch. ; Gebner, T.

Author_Institution :

Technische Universitat Chemnitz-Zwickau

fYear :

1997

fDate :

16-19 March 1997

Firstpage :

127

Lastpage :

127

Keywords :

Annealing; Atmosphere; Copper; Hydrogen; Metallization; Optical films; Semiconductor films; Semiconductor materials; Stability; Tin;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop

Conference_Location :

Villard de Lans, France

ISSN :

1266-0167

Type :

conf

DOI :

10.1109/MAM.1998.887540

Filename :

887540

Link To Document :