DocumentCode

2680497

Title

TiN diffusion barriers for copper metalization

Author

Baumann, J. ; Werner, T. ; Rennau, M. ; Kaufmann, Ch. ; Gebner, T.

Author_Institution

Technische Universitat Chemnitz-Zwickau

fYear

1997

fDate

16-19 March 1997

Firstpage

127

Lastpage

127

Keywords

Annealing; Atmosphere; Copper; Hydrogen; Metallization; Optical films; Semiconductor films; Semiconductor materials; Stability; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop

Conference_Location

Villard de Lans, France

ISSN

1266-0167

Type

conf

DOI

10.1109/MAM.1998.887540

Filename

887540