• DocumentCode
    268051
  • Title

    Magnetostrictive type tactile sensor based on metal embedded polymer architecture

  • Author

    Chang, Hsie-Chia ; Sung, W.-L. ; Hsieh, H.-S. ; Wen, J.-H. ; Fu, C.-C. ; Liao, S.-C. ; Lai, Chi-Hui ; Lai, Wei-Chi ; Chang, Chih-Hung ; Chang, Chorng-Ping ; Chen, Chun-Hung ; Fang, Wanliang

  • Author_Institution
    Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2014
  • fDate
    26-30 Jan. 2014
  • Firstpage
    1189
  • Lastpage
    1192
  • Abstract
    This study presents new process scheme to fabricate polymer structure with embedded metal on silicon substrate. The primary merit of presented process scheme is: simple approach for the integration of 3D structures with different materials (e.g. metal, glass, polymer) on substrate. To demonstrate the feasibility of the proposed process scheme, a tactile sensor design consisting of polymer structure with embedded 3D Ni coil winding is implemented. As the polymer diaphragm deformed by tactile force, the magnetostriction effect of the 3D Ni coil inductor will induce the permeability change. Thus, the permeability change as well as the tactile force can be detected by the inductance variation. Preliminary measurements show the sensitivity of magnetostrictive type tactile sensor based on the proposed metal embedded polymer architecture is near 1.33%/N at the sensing range of 0~1N.
  • Keywords
    coils; inductors; magnetic permeability; magnetic sensors; magnetostriction; magnetostrictive devices; nickel; polymers; silicon; tactile sensors; windings; 3D Ni coil inductor; 3D Ni coil winding; 3D structures; Ni; Si; inductance variation; magnetostriction effect; magnetostrictive type tactile sensor; metal embedded polymer architecture; permeability change; polymer diaphragm; polymer structure; tactile force; tactile sensor design; Coils; Magnetostriction; Nickel; Silicon; Tactile sensors; Three-dimensional displays; Windings;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
  • Conference_Location
    San Francisco, CA
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2014.6765860
  • Filename
    6765860