DocumentCode

2680519

Title

TiN/W double layers as a barrier system for use in Cu metalization

Author

Baumann, Joerg ; Markert, M. ; Werner, T. ; Rennau, Michael ; Kaufmann, Ch. ; Gebner, T.

Author_Institution

Universitat Chemnitz-Zwickau

fYear

1997

fDate

16-19 March 1997

Firstpage

128

Lastpage

129

Keywords

Adhesives; Annealing; Copper; Electric resistance; Electromigration; Integrated circuit interconnections; Metallization; Optical films; Optical microscopy; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop

Conference_Location

Villard de Lans, France

ISSN

1266-0167

Type

conf

DOI

10.1109/MAM.1998.887541

Filename

887541