DocumentCode :
2680519
Title :
TiN/W double layers as a barrier system for use in Cu metalization
Author :
Baumann, Joerg ; Markert, M. ; Werner, T. ; Rennau, Michael ; Kaufmann, Ch. ; Gebner, T.
Author_Institution :
Universitat Chemnitz-Zwickau
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
128
Lastpage :
129
Keywords :
Adhesives; Annealing; Copper; Electric resistance; Electromigration; Integrated circuit interconnections; Metallization; Optical films; Optical microscopy; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887541
Filename :
887541
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2680519
بازگشت