Title :
Gap filling with high current pulsed are evaporation : influence of deposition parameters
Author :
Klimes, W. ; Wenzel, C. ; Siemroth, P. ; Schultrich, B.
Author_Institution :
Dresden University of Technology
Keywords :
Atherosclerosis; Copper; Filling; Inorganic materials; Laboratories; Metallization; Physics; Semiconductor materials; Sputtering; Substrates;
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
DOI :
10.1109/MAM.1998.887545
