DocumentCode :
268060
Title :
Uncooled multi-band IR imaging using bimaterial cantilever FPA
Author :
Wei Ma ; Shuyang Wang ; Yongzheng Wen ; Yuejin Zhao ; Liquan Dong ; Ming Liu ; Xiaohua Liu ; Xiaomei Yu
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing, China
fYear :
2014
fDate :
26-30 Jan. 2014
Firstpage :
1225
Lastpage :
1228
Abstract :
This paper presents the design, fabrication and performance of a 256×256 bimaterial cantilever focal plane array (FPA) which is able to work in the three infrared (IR) atmospheric windows of 1~2.5μm, 3~5μm and 8~14μm simultaneously. The FPA employs a silicon-framed structure by selectively etching away the substrate with Deep Reactive Ion Etching technique, and a stacked layer of chromium and SiNx serves as the multi-band absorber. The images of short wavelength, middle wavelength and long wavelength infrared were captured successfully with the same FPA by combining the Chromium nano-film with silicon nitride as the multi-band IR absorber. The measured sensitivity of the FPA is 0.18μm/K.
Keywords :
cantilevers; chromium; elemental semiconductors; focal planes; infrared imaging; silicon; silicon compounds; sputter etching; FPA; IR atmospheric window; Si-Cr-SiNx; bimaterial cantilever focal plane array; chromium nanofilm; deep reactive ion etching technique; infrared atmospheric window; multiband IR absorber; silicon-framed structure; stacked chromium layer; uncooled multiband IR imaging; wavelength 1 mum to 2.5 mum; wavelength 3 mum to 5 mum; wavelength 8 mum to 14 mum; Absorption; Films; Gold; Mirrors; Silicon; Substrates; Temperature sensors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2014 IEEE 27th International Conference on
Conference_Location :
San Francisco, CA
Type :
conf
DOI :
10.1109/MEMSYS.2014.6765869
Filename :
6765869
Link To Document :
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