DocumentCode

2680610

Title

Reduction of molybdenum resistivity by a seed layer of Ti-W

Author

Franssila, S. ; Kattelus, H. ; Nykanen, E.

Author_Institution

VTT Electronics

fYear

1997

fDate

16-19 March 1997

Firstpage

140

Lastpage

142

Keywords

Argon; Conductive films; Conductivity; Inorganic materials; Metallization; Plasma temperature; Rapid thermal annealing; Silicon; Sputtering; Stress control;

fLanguage

English

Publisher

ieee

Conference_Titel

Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop

Conference_Location

Villard de Lans, France

ISSN

1266-0167

Type

conf

DOI

10.1109/MAM.1998.887548

Filename

887548