مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

2680652

Title :

Stress in copper films for interconnects

Author :

Riedel, S. ; Röber, J. ; Schulz, S.E. ; Gebner, T.

Author_Institution :

Technische Universitat Chemnitz-Zwickau

fYear :

1997

fDate :

16-19 March 1997

Firstpage :

148

Lastpage :

149

Keywords :

Copper; Electric resistance; Inorganic materials; Integrated circuit interconnections; Internal stresses; Metallization; Stress measurement; Temperature measurement; Tensile stress; Thermal stresses;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop

Conference_Location :

Villard de Lans, France

ISSN :

1266-0167

Type :

conf

DOI :

10.1109/MAM.1998.887551

Filename :

887551

Link To Document :

https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2680652