• DocumentCode
    2680700
  • Title

    Mechanism studies of Cu RIE for VLSI interconnections

  • Author

    Markert, M. ; Bertz, A. ; Gessner, T.

  • Author_Institution
    TU Chemnitz-Zwickau
  • fYear
    1997
  • fDate
    16-19 March 1997
  • Firstpage
    155
  • Lastpage
    157
  • Keywords
    Copper; Inorganic materials; Integrated circuit interconnections; Mass spectroscopy; Metallization; Plasma temperature; Sputter etching; Surface discharges; Ultra large scale integration; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
  • Conference_Location
    Villard de Lans, France
  • ISSN
    1266-0167
  • Type

    conf

  • DOI
    10.1109/MAM.1998.887554
  • Filename
    887554
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2680700