DocumentCode :
2680700
Title :
Mechanism studies of Cu RIE for VLSI interconnections
Author :
Markert, M. ; Bertz, A. ; Gessner, T.
Author_Institution :
TU Chemnitz-Zwickau
fYear :
1997
fDate :
16-19 March 1997
Firstpage :
155
Lastpage :
157
Keywords :
Copper; Inorganic materials; Integrated circuit interconnections; Mass spectroscopy; Metallization; Plasma temperature; Sputter etching; Surface discharges; Ultra large scale integration; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location :
Villard de Lans, France
ISSN :
1266-0167
Type :
conf
DOI :
10.1109/MAM.1998.887554
Filename :
887554
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2680700
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