• DocumentCode
    2680714
  • Title

    Variation-aware electromigration analysis of power/ground networks

  • Author

    Li, Di-an ; Marek-Sadowska, Malgorzata

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of California, Santa Barbara, CA, USA
  • fYear
    2011
  • fDate
    7-10 Nov. 2011
  • Firstpage
    571
  • Lastpage
    576
  • Abstract
    Due to shrinking wire dimensions, higher current density, and process variations, electromigration (EM) has become a major reliability problem. The existing backend design flows use the maximum allowed current density as the only practical guidance to prevent EM. There is a need for tools capable of performing comprehensive EM analyses. In this paper, we first explain why current density alone does not determine wire´s susceptibility to EM. We introduce our variation-aware EM analysis tool, VEMA, for power/ground networks, which are typically the EM-critical parts of a chip. Our tool considers two types of variations: circuit-level and wire geometry-level. VEMA reports distributions of wire lifetimes for circuit-level variations. Compared to existing EM analyzer SysRel, VEMA filters out EM-immortal wires more efficiently and provides detailed feedback for EM violation corrections. VEMA also provides information of geometry-level tolerance for EM-mortal wires.
  • Keywords
    current density; electromigration; integrated circuit reliability; microprocessor chips; wires (electric); EM analyzer SysRel; EM-critical parts; EM-immortal wires; VEMA filters; chip; circuit-level; current density; geometry-level tolerance; power/ground networks; reliability problem; shrinking wire dimensions; variation aware electromigration; wire geometry-level; wire susceptibility; Current density; Finite element methods; Integrated circuit modeling; Metals; Solid modeling; Stress; Wires; Electromigration; lifetime distribution; power/ground network; process variation; variation tolerance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design (ICCAD), 2011 IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Print_ISBN
    978-1-4577-1399-6
  • Electronic_ISBN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2011.6105387
  • Filename
    6105387