DocumentCode
2681178
Title
Three dimensional metallization for vertically integrated circuits
Author
Bollmann, D. ; Braun, R. ; Buchner, R. ; Cao-Minh, U. ; Engelhardt, M. ; Errmann, G. ; Grabl, T. ; Hieber, K. ; Hübner, H. ; Kawala, G. ; Kleiner, M. ; Klumpp, A. ; Kühn, S. ; Landesberger, C. ; Lezec, H. ; Muth, W. ; Pamler, W. ; Popp, R. ; Renner, E. ;
Author_Institution
Siemens AG Corporate Technology, Microelectronics
fYear
1997
fDate
16-19 March 1997
Firstpage
94
Lastpage
98
Keywords
Copper; Europe; Fabrication; Inorganic materials; Integrated circuit metallization; Integrated circuit technology; Microelectronics; Solid state circuits; Wafer bonding; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Materials for Advanced Metallization, 1997. MAM '97 Abstracts Booklet., European Workshop
Conference_Location
Villard de Lans, France
ISSN
1266-0167
Type
conf
DOI
10.1109/MAM.1998.887612
Filename
887612
Link To Document