DocumentCode :
268120
Title :
Al-Foil on Encapsulant for the Interconnection of Al-Metalized Silicon Solar Cells
Author :
Schulte-Huxel, H. ; Blankemeyer, S. ; Bock, R. ; Merkle, A. ; Kajari-Schröder, S. ; Brendel, R.
Author_Institution :
Inst. for Solar Energy Res. Hamelin, Emmerthal, Germany
Volume :
3
Issue :
1
fYear :
2013
fDate :
Jan. 2013
Firstpage :
77
Lastpage :
82
Abstract :
We demonstrate the interconnection of silicon solar cells with evaporated aluminum back contacts using an aluminum foil which is attached to a silicone encapsulant. The aluminum-based mechanical and electrical laser interconnection (AMELI) process forms laser weld spots using single laser pulses. These laser welds resist high mechanical stresses and have a low electrical contact resistivity. No solder, conductive adhesives, or Ag-pastes are required for interconnection. We find the electrical contact resistivity to be below ρc = 0.01 mΩ·cm2. The contact resistance is constant under accelerated aging of 300 humidity-freeze cycles. With a tensile testing machine, we measure tear-off stresses in the perpendicular direction of up to 380 kPa for our laser weld spots. We present a proof-of-concept module which consists of five n-type back-junction back-contact solar cells with a conversion efficiency of 20.4%. The unchanged fill factor FF and open circuit voltage Voc verify a damage- and loss-free interconnection which is supported by electroluminescence measurements.
Keywords :
aluminium; contact resistance; electrical contacts; electrical resistivity; electroluminescence; elemental semiconductors; encapsulation; interconnections; internal stresses; laser beam welding; laser materials processing; semiconductor device metallisation; silicon; solar cells; tensile testing; Al; Al-metalized silicon solar cells; Si; accelerated aging; aluminum foil; aluminum-based AMELI process; contact resistance; conversion efficiency; damage-free interconnection; electrical contact resistivity; electrical laser interconnection; electroluminescence measurements; evaporated aluminum back contacts; fill factor; laser weld spots; loss-free interconnection; mechanical laser interconnection; mechanical stresses; n-type back-junction back-contact solar cells; open circuit voltage; perpendicular direction; proof-of-concept module; silicon solar cell interconnection; silicone encapsulant; single laser pulses; tear-off stresses; tensile testing machine; Electrical resistance measurement; Glass; Lamination; Lasers; Measurement by laser beam; Photovoltaic cells; Welding; Al-metallization; back-contact solar cells; laser microwelding; lead-free; module-level inter-connection; photovoltaic module;
fLanguage :
English
Journal_Title :
Photovoltaics, IEEE Journal of
Publisher :
ieee
ISSN :
2156-3381
Type :
jour
DOI :
10.1109/JPHOTOV.2012.2208096
Filename :
6264076
Link To Document :
بازگشت