• DocumentCode
    268148
  • Title

    Effect of the Mission Profile on the Reliability of a Power Converter Aimed at Photovoltaic Applications—A Case Study

  • Author

    De León-Aldaco, S.E. ; Calleja, H. ; Chan, F. ; Jiménez-Grajales, H.R.

  • Author_Institution
    Nat. Center for R&D of Technol., Cuernavaca, Mexico
  • Volume
    28
  • Issue
    6
  • fYear
    2013
  • fDate
    Jun-13
  • Firstpage
    2998
  • Lastpage
    3007
  • Abstract
    This paper presents the reliability analysis of a push-pull converter intended for connection to a 125-W photovoltaic (PV) panel. Four prototypes of the converter were built and tested, using transistors with different ratings. Failure rates were calculated using the MIL HDBK 217 and the IEC TR 62380 procedures. In the latter case, the prediction was performed taking into account an annual mission profile obtained from the intended installation site, in an area with desert climate temperatures. Failure rate results obtained with MIL HDBK 217 show small differences among the converters, the best performance obtained from the prototype with the lowest on-resistance. Results obtained with IEC TR 62380 indicate that thermal cycles have a significant effect in reliability performance, and should be considered carefully, because PV systems often see large temperature variations. With both procedures, the failure rate contributions from magnetic devices were higher than expected.
  • Keywords
    circuit reliability; military equipment; military standards; photovoltaic power systems; power convertors; IEC TR 62380; MIL HDBK 217; mission profile; photovoltaic application; photovoltaic panel; power 125 W; power converter reliability; push-pull converter; temperature variation; thermal cycles; Integrated circuit reliability; Prototypes; Stress; Temperature; Temperature measurement; Transistors; Photovoltaic (PV) power systems; power conversion; reliability; reliability estimation;
  • fLanguage
    English
  • Journal_Title
    Power Electronics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-8993
  • Type

    jour

  • DOI
    10.1109/TPEL.2012.2222673
  • Filename
    6323041