• DocumentCode
    2682359
  • Title

    Failure analysis of LEDs

  • Author

    Guoguang, Lu ; Shaohua, Yang ; Zhifeng, Lei

  • Author_Institution
    Applic. of Electron. Component Lab., Sci. & Technol. on Reliability Phys, Guangzhou, China
  • fYear
    2011
  • fDate
    25-28 Oct. 2011
  • Firstpage
    69
  • Lastpage
    72
  • Abstract
    Light-emitting diodes (LEDS) are a strong candidate for the nest-generation general illumination applications. The reliability of LEDs is the key point for its applications, and the main challenges facing the development of high reliable LED is packaging process. In this paper, the overview of state of the art techniques in LED failure analysis is provided, and the main failure modes such as bonding defects, die attaching defects and other defects that caused by poor package process are investigated through some failure analysis cases.
  • Keywords
    electronics packaging; failure analysis; light emitting diodes; reliability; LED reliability; bonding defects; die attaching defects; failure analysis; illumination applications; light-emitting diodes; packaging process; Bonding; Failure analysis; Light emitting diodes; Materials; Microassembly; Packaging; Reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials (APM), 2011 International Symposium on
  • Conference_Location
    Xiamen
  • ISSN
    1550-5723
  • Print_ISBN
    978-1-4673-0148-0
  • Type

    conf

  • DOI
    10.1109/ISAPM.2011.6105673
  • Filename
    6105673
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2682359