DocumentCode
2682614
Title
Thermal conductivity and microhardness of MWCNTs/copper nanocomposites
Author
Xu, L.S. ; Chen, X.H. ; Liu, X.J. ; Yu, Y. ; Wu, Y.R.
Author_Institution
Dept. of Mater. Sci. & Eng., Xiamen Univ. of Technol., Xiamen, China
fYear
2011
fDate
25-28 Oct. 2011
Firstpage
26
Lastpage
30
Abstract
The effects of dispersion states of carbon nanotubes on thermal conductivity and Micro-hardness of Multi-walled carbon nanotube (MWCNT) reinforced copper nanocomposites were investigated. The nanocomposites were fabricated in a novel method. It involves the synthesis of MWCNT-implanted copper composite spheres and the preparation of the MWCNT/copper bulk materials using vacuum hot pressing and hot rolling. The thermal conductivity of the composites with different concentration of MWCNTs were measured. Although the coefficient of thermal conductivity decreases with the increase of the MWCNT content, it is still high enough to be used as electronic packaging materials even the concentration of MWCNTS in the composite is up to 5 wt%. Furthermore, the microhardness of the nanocomposites are much higher than that of pure copper, which is ascribed to the good dispersion of the MWCNTs in matrix.
Keywords
carbon nanotubes; copper; disperse systems; hot pressing; hot rolling; microhardness; nanocomposites; nanofabrication; particle reinforced composites; thermal conductivity; C-Cu; dispersion states; electronic packaging materials; hot rolling; microhardness; multiwalled carbon nanotubes reinforced copper nanocomposites; thermal conductivity; vacuum hot pressing; Carbon nanotubes; Conductivity; Copper; Electronic packaging thermal management; Nanocomposites; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location
Xiamen
ISSN
1550-5723
Print_ISBN
978-1-4673-0148-0
Type
conf
DOI
10.1109/ISAPM.2011.6105686
Filename
6105686
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