• DocumentCode
    2682614
  • Title

    Thermal conductivity and microhardness of MWCNTs/copper nanocomposites

  • Author

    Xu, L.S. ; Chen, X.H. ; Liu, X.J. ; Yu, Y. ; Wu, Y.R.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Xiamen Univ. of Technol., Xiamen, China
  • fYear
    2011
  • fDate
    25-28 Oct. 2011
  • Firstpage
    26
  • Lastpage
    30
  • Abstract
    The effects of dispersion states of carbon nanotubes on thermal conductivity and Micro-hardness of Multi-walled carbon nanotube (MWCNT) reinforced copper nanocomposites were investigated. The nanocomposites were fabricated in a novel method. It involves the synthesis of MWCNT-implanted copper composite spheres and the preparation of the MWCNT/copper bulk materials using vacuum hot pressing and hot rolling. The thermal conductivity of the composites with different concentration of MWCNTs were measured. Although the coefficient of thermal conductivity decreases with the increase of the MWCNT content, it is still high enough to be used as electronic packaging materials even the concentration of MWCNTS in the composite is up to 5 wt%. Furthermore, the microhardness of the nanocomposites are much higher than that of pure copper, which is ascribed to the good dispersion of the MWCNTs in matrix.
  • Keywords
    carbon nanotubes; copper; disperse systems; hot pressing; hot rolling; microhardness; nanocomposites; nanofabrication; particle reinforced composites; thermal conductivity; C-Cu; dispersion states; electronic packaging materials; hot rolling; microhardness; multiwalled carbon nanotubes reinforced copper nanocomposites; thermal conductivity; vacuum hot pressing; Carbon nanotubes; Conductivity; Copper; Electronic packaging thermal management; Nanocomposites; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials (APM), 2011 International Symposium on
  • Conference_Location
    Xiamen
  • ISSN
    1550-5723
  • Print_ISBN
    978-1-4673-0148-0
  • Type

    conf

  • DOI
    10.1109/ISAPM.2011.6105686
  • Filename
    6105686