Title :
The kinetics of interfacial interaction between eutectic Sn9Zn solder and nickel plating
Author :
Kuo, Yao-Ling ; Lin, Kwang-Lung
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Abstract :
The interfacial interaction between liquid eutectic Sn9Zn solder and electroplated Ni layer was investigated in the temperatures range of 230 ~ 290°C. The interaction gives rise to various Ni-Zn intermetallic compounds, Ni5Zn21 and NiZn3, and Ni-Zn solid solution layer. The evolution of these layers is temperature dependent. The thickness of the interfacial reaction layer was measured with respect to reaction temperature and reaction time. The growth behavior of the interfacial layer and the activation energy of the interaction were discussed. The reaction mechanism was found to vary with respect to reaction temperature.
Keywords :
electronics packaging; electroplating; eutectic alloys; nickel alloys; reaction kinetics; solders; solid solutions; surface chemistry; tin alloys; zinc alloys; Ni-Zn; SnZn; activation energy; interfacial interaction kinetics; interfacial layer growth behavior; interfacial reaction layer; intermetallic compounds; liquid eutectic solder; reaction temperature; reaction time; solid solution layer; temperature 230 degC to 290 degC; temperature dependent; Copper; Nickel; Packaging; Solids; Temperature measurement; Zinc;
Conference_Titel :
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location :
Xiamen
Print_ISBN :
978-1-4673-0148-0
DOI :
10.1109/ISAPM.2011.6105698
