The kinetics of interfacial interaction between eutectic Sn9Zn solder and nickel plating

Author

Kuo, Yao-Ling ; Lin, Kwang-Lung

Author_Institution

Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan

fYear

2011

fDate

25-28 Oct. 2011

Firstpage

193

Lastpage

198

Abstract

The interfacial interaction between liquid eutectic Sn9Zn solder and electroplated Ni layer was investigated in the temperatures range of 230 ~ 290°C. The interaction gives rise to various Ni-Zn intermetallic compounds, Ni₅Zn₂₁ and NiZn₃, and Ni-Zn solid solution layer. The evolution of these layers is temperature dependent. The thickness of the interfacial reaction layer was measured with respect to reaction temperature and reaction time. The growth behavior of the interfacial layer and the activation energy of the interaction were discussed. The reaction mechanism was found to vary with respect to reaction temperature.

Keywords

electronics packaging; electroplating; eutectic alloys; nickel alloys; reaction kinetics; solders; solid solutions; surface chemistry; tin alloys; zinc alloys; Ni-Zn; SnZn; activation energy; interfacial interaction kinetics; interfacial layer growth behavior; interfacial reaction layer; intermetallic compounds; liquid eutectic solder; reaction temperature; reaction time; solid solution layer; temperature 230 degC to 290 degC; temperature dependent; Copper; Nickel; Packaging; Solids; Temperature measurement; Zinc;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials (APM), 2011 International Symposium on

Conference_Location

Xiamen

ISSN

1550-5723

Print_ISBN

978-1-4673-0148-0

Type

conf

DOI

10.1109/ISAPM.2011.6105698

Filename

6105698