A microstrip array fed by a nonhomogeneous stripline feeding network

Using high-dielectric plugs instead of via-holes eliminates the need for ohmic contact, which sometimes is difficult to ensure in the vias. This technological process requires one less plating round which considerably reduces the price of the product. All the layers are simultaneously processed and bonded together in the same way stripline circuits are. A 4×4 microstrip array fed by a feeding network which makes use of this new technology was built and tested. The implementation of this technique at 66 GHz is being considered