• DocumentCode
    2682945
  • Title

    Synthesis and low-temperature sintering of tin-doped silver nanoparticles

  • Author

    Zhang, Yujun ; Yu, Hui ; Li, Liangliang

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Tsinghua Univ., Beijing, China
  • fYear
    2011
  • fDate
    25-28 Oct. 2011
  • Firstpage
    209
  • Lastpage
    212
  • Abstract
    Ag nanoparticles have been widely used in electronic packaging due to their low-temperature sintering properties. It is important to lower the melting point of Ag nanoparticles to achieve a better electrical/thermal conduction and mechanical strength. In this paper, a large amount of Sn-doped Ag nanoparticles with a size less than 10 nm were synthesized and the EDS and XRD data showed that the Sn atoms entered the Ag lattice. The sintering properties of the nanoparticles baked at different temperatures was investigated by SEM and a larger coalescence was observed for the Sn-doped Ag nanoparticles compared to the pure Ag nanoparticles, indicating that Sn helped the sintering of the nanoparticles. TGA and DSC experiments were also carried out to study the sintering process in detail.
  • Keywords
    X-ray chemical analysis; X-ray diffraction; differential scanning calorimetry; electrical conductivity; nanofabrication; nanoparticles; scanning electron microscopy; silver; sintering; thermal conductivity; tin; Ag:Sn; DSC; EDS; SEM; TGA; XRD; electrical conduction; electronic packaging; low-temperature sintering; mechanical strength; melting point; nanoparticles; thermal conduction; Lattices; Materials; Nanoparticles; Scanning electron microscopy; Silver; Tin; X-ray scattering; nanoparticles; sintering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials (APM), 2011 International Symposium on
  • Conference_Location
    Xiamen
  • ISSN
    1550-5723
  • Print_ISBN
    978-1-4673-0148-0
  • Type

    conf

  • DOI
    10.1109/ISAPM.2011.6105702
  • Filename
    6105702