DocumentCode :
2683084
Title :
Study on soldering flux used for Sn-0.7Cu welding wire
Author :
Wang, Cuiping ; Wang, Jian ; Chen, Liang ; Li, Yuechan ; Liu, Xingjun
Author_Institution :
Coll. of Mater., Xiamen Univ., Xiamen, China
fYear :
2011
fDate :
25-28 Oct. 2011
Firstpage :
246
Lastpage :
249
Abstract :
The wettability and corrosiveness of some organic acids were tested to choose an appropriate activator. Then orthogonal design method was used to determine the proportion among the components of the activator. At last a certain amount of water-white rosin was added to further optimize the dispensation. The final soldering flux for Sn-0.7Cu welding wire caters to the demands of welding process such as good weld ability, good liquidity, less smoke, full and shiny welding spot.
Keywords :
copper alloys; corrosion; organic compounds; soldering; tin alloys; welding; wetting; Sn-Cu; corrosiveness; organic acids; orthogonal design method; soldering flux; water-white rosin; welding process; welding spot; welding wire; wettability; Copper; Lead; Soldering; Substrates; Welding; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Packaging Materials (APM), 2011 International Symposium on
Conference_Location :
Xiamen
ISSN :
1550-5723
Print_ISBN :
978-1-4673-0148-0
Type :
conf
DOI :
10.1109/ISAPM.2011.6105709
Filename :
6105709
Link To Document :
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