Characteristics of a new non-rosin, lead-free solder paste activity system

Author

Wang, Cuiping ; Wang, Jian ; Wang, Juan ; Chen, Liang ; Liu, Xingjun

Author_Institution

Coll. of Mater., Xiamen Univ., Xiamen, China

fYear

2011

fDate

25-28 Oct. 2011

Firstpage

250

Lastpage

256

Abstract

In this work, an activator system used for no-rosin lead-free solder paste was prepared by compounding with 5-Sulposalicylic acid dehydrate and an organic which restrains the over-quick release of the activator. The composition of the active system was studied by thermal gravimetric analysis. Additional, characterizations of the solder paste with various formula such as viscosity, wettability and shelf life have been evaluated. The solder paste performs the best wettability, the lowest residue, and improved shelf life when the weight percentage of 5-Sulposalicylic acid dehydrate to activity control agent is 20 to 47 in the activity system,.

Keywords

life testing; organic compounds; solders; thermal analysis; thermodynamic properties; wetting; 5-sulposalicylic acid dehydrate; activator system; active system composition; activity control agent; nonrosin lead-free solder paste activity system; shelf life; thermal gravimetric analysis; wettability; Lead; Ovens; Soldering; Viscosity; Welding;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Packaging Materials (APM), 2011 International Symposium on

Conference_Location

Xiamen

ISSN

1550-5723

Print_ISBN

978-1-4673-0148-0

Type

conf

DOI

10.1109/ISAPM.2011.6105710

Filename

6105710